Patent · US Active

Packaged device comprising non-integer lead pitches and method of manufacturing the same

US9035437B2 · kind B2 · utility

0Cited by

6References

18Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Ralf Otremba · Kaufbeuren, DE
Guenther Lohmann · Sattendorf, AT
Josef Hoeglauer · Munich, DE
Teck Sim Lee · Melaka City, MY
Matteo-Alessandro Kutschak · Ludmannsdorf, DE
Wolfgang Peinhopf · Klagenfurt, AT

Key dates

Filing date	Mar 12, 2013
Grant date	May 19, 2015
Priority date	—
Expiry date	Mar 12, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device includes a first chip, a package encapsulating the first chip and a plurality of leads protruding from the package, wherein the plurality of leads comprises differing non-integer multiple lead pitches.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.