Guenther Lohmann
5Patents
2h-index
17Co-inventors
40Inventor score
Filing activity: Mar 12, 2013 → Jan 8, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10373897B2 | Semiconductor devices with improved thermal and electrical performance | Electricity | 3 | Active |
| US10566260B2 | SMD package with top side cooling | Electricity | 3 | Active |
| US11211304B2 | Assembly and method for mounting an electronic component to a substrate | Electricity | 0 | Active |
| US9035437B2 | Packaged device comprising non-integer lead pitches and method of manufacturing the same | Electricity | 0 | Active |
| US10903133B2 | Method of producing an SMD package with top side cooling | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.