Method of inspecting wafer
US9036895B2 · kind B2 · utility
4Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2013 |
| Grant date | May 19, 2015 |
| Priority date | — |
| Expiry date | Jul 20, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of inspecting a wafer includes performing a fabricating process on a wafer, irradiating broadband light on the wafer, such that the light is reflected from the wafer, generating a spectral cube by using the light reflected from the wafer, extracting a spectrum of a desired wafer inspection region from the spectral cube, and inspecting the desired wafer inspection region by analyzing the extracted spectrum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.