Non-uniform vacuum profile die attach tip
US9038264B2 · kind B2 · utility
0Cited by
11References
5Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 28, 2011 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Feb 28, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53283
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.