Kim Lee Bock
6Patents
1h-index
26Co-inventors
47Inventor score
Filing activity: Feb 28, 2011 → Mar 10, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9773766B2 | Semiconductor device including independent film layer for embedding and/or spacing semiconductor die | Electricity | 4 | Active |
| US10418334B2 | Semiconductor device including corner recess | Electricity | 1 | Active |
| US11177241B2 | Semiconductor device with top die positioned to reduce die cracking | Electricity | 0 | Active |
| US10128218B2 | Semiconductor device including die bond pads at a die edge | Electricity | 0 | Active |
| US9038264B2 | Non-uniform vacuum profile die attach tip | Emerging Cross-Sectional Technologies | 0 | Active |
| US10283485B2 | Semiconductor device including conductive bump interconnections | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.