Polishing slurry composition
US9039925B2 · kind B2 · utility
5Cited by
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24Claims
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Key dates
| Filing date | Aug 7, 2012 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Aug 7, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided is a polishing slurry composition, including a non-ionic surfactant represented by the following formula (1)R—(OCH2CH2)x—OH formula (1)wherein x is an integer from 1 to 50, and R is selected from a group consisting of a C3-C50 alkyl group, a C6-C55 benzylalkyl group and a C6-C55 phenylalkyl group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.