Radiation-sensitive resin composition, method for forming resist pattern, and polymer and compound
US9040221B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2011 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Aug 22, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F220/24
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A radiation-sensitive resin composition that provides a resist coating film in a liquid immersion lithography process is provided, the radiation-sensitive resin composition being capable of exhibiting a great dynamic contact angle during exposure, whereby the surface of the resist coating film can exhibit a superior water draining property, and the radiation-sensitive resin composition being capable of leading to a significant decrease in the dynamic contact angle during development, whereby generation of development defects can be inhibited, and further shortening of a time period required for change in a dynamic contact angle is enabled. A radiation-sensitive resin composition including (A) a fluorine-containing polymer having a structural unit (I) that includes a group represented by the following formula (1), and (B) a radiation-sensitive acid generator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.