Package structure and methods of forming same
US9041015B2 · kind B2 · utility
13Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2013 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | May 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/183
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor device, a package structure, and methods of forming the same are disclosed. An embodiment is a semiconductor device comprising a first optical device over a first substrate, a vertical waveguide on a top surface of the first optical device, and a second substrate over the vertical waveguide. The semiconductor device further comprises a lens capping layer on a top surface of the second substrate, wherein the lens capping layer is aligned with the vertical waveguide, and a second optical device over the lens capping layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.