Monolithic power converter package
US9041175B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2012 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Nov 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to an exemplary embodiment, a monolithic power converter package includes a monolithic die over a substrate, the monolithic die integrating a driver integrated circuit (IC) with a control power transistor and a sync power transistor connected in a half-bridge. A high side power input, a low side power input, and a power output of the half-bridge are each disposed on a top surface of the monolithic die. The high side power input is electrically and mechanically coupled to the substrate by a high side power strip. Also, the low side power input is electrically and mechanically coupled to the substrate by a low side power strip. Furthermore, the power output is electrically and mechanically coupled to the substrate by a power output strip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.