Semiconductor device
US9041197B2 · kind B2 · utility
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6Claims
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Assignee
Inventor
Key dates
| Filing date | Sep 10, 2014 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Sep 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02476
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor device includes a semiconductor element having a substrate of GaAs, InP, or GaN, and an element securing member bonded to the semiconductor element by solder. The element securing member is a composite material of Cu and carbon or a composite of Al and carbon. A stem is connected to the element securing member, and a cap is secured to the stem. The cap covers the semiconductor element and the element securing member. The stem and the element securing member are made of the same material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.