Patent · US Active

Seal method for direct liquid cooling of probes used at first level interconnect

US9046569B2 · kind B2 · utility

8Cited by

2References

23Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Ronald Michael Kirby · Portland, US
James G. Maveety · San Jose, US
Joe Walczyk · Tigard, US

Key dates

Filing date	Nov 5, 2012
Grant date	Jun 2, 2015
Priority date	—
Expiry date	Jul 9, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49826
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Embodiments of an apparatus and method for providing cooling of probes for testing of integrated circuits are generally described herein. In some embodiments, an apparatus comprises a probe head assembly configured to hold one or more probes that are adapted to provide electrical contact with an integrated circuit device under test (DUT), a DUT chuck adapted to hold the DUT for contact with the probes, a seal arranged between the probe head assembly and the DUT chuck to form a chamber when the seal is in contact with the probe head assembly and the DUT chuck, and a first port and a second port arranged to provide fluid flow into and fluid flow out of the chamber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.