Highly conductive composites
US9048009B2 · kind B2 · utility
1Cited by
6References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2012 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Nov 21, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Domain segregation of polymer blends or block copolymers in the presence of thermal conducting high aspect ratio nanocrystals leads to preferential placement of conductive filler either inside one domain, which promote the self-assembly of a thermal and/or electrical conducting pathway composed of high aspect ratio filler. The self-assembly of such thermal and/or electrical conducting pathway effectively enhances the thermal and/or electrical conductivity of the composite with significantly less amount of filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.