Electrically bonded arrays of transfer printed active components
US9049797B2 · kind B2 · utility
63Cited by
1References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2011 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | May 11, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.