Heat-resistant polyamide composition and application thereof
US9051454B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 8, 2011 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | Dec 8, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention discloses a heat-resistant polyamide composition and application thereof. The composition comprises the following components in percentage by weight: 40% to 90% of heat-resistant polyamide resin, 5% to 35% of mineral fiber A, 0 to 35% of mineral filler B, 0.1% to 1% of light stabilizer, 0.1% to 1% of flow modifier and 0.1% to 1% of antioxidant. In the present invention, heat-resistant polyamide resin with the ratio of amine-terminated group and carboxyl-terminated group between 0.1 and 0.8 is selected to be matched with deformed glass fibers with an aspect ratio of 2 to 6, the mineral filler B and the flow modifier to obtain the heat-resistant polyamide composition. The heat-resistant polyamide composition not only has high initial whiteness, high reflectivity and excellent heat resistance, but also has good moldability and good dimensional stability; therefore, the heat-resistant polyamide composition is capable of being applied for preparing the reflecting supports for such light sources as LCD backlight of portable phones, computers, televisions and the like, as well as headlights of automotive vehicles, instrument panels and lighting appliances, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.