Nanostructuring process for ingot surface, water manufacturing method, and wafer using the same
US9051664B2 · kind B2 · utility
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3References
14Claims
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Key dates
| Filing date | Jan 19, 2012 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | Jun 14, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24777
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The instant disclosure relates to a nanostructuring process for an ingot surface prior to the slicing operation. A surface treatment step is performed for at least one surface of the ingot in forming a nanostructure layer thereon. The nanostructure layer is capable of enhancing the mechanical strength of the ingot surface to reduce the chipping ratio of the wafer during slicing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.