Patent · US Active

Wafer prober integrated with full-wafer contactor

US9052355B2 · kind B2 · utility

2Cited by
20References
14Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMar 10, 2011
Grant dateJun 9, 2015
Priority date—
Expiry dateMar 10, 2031

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R31/2889
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Methods and apparatus for testing unsingulated integrated circuits on a wafer include adapting a wafer prober for use with full-wafer-contacter disposed on the wafer. Some embodiments include placing wafer on a chuck of the prober, aligning the wafer to a full-wafer contacter incorporated in the wafer prober, removably attaching the wafer to the full wafer contacter, separating the wafer from the chuck, and making electrical contact to one or more integrated circuits of the wafer by making physical contact with a surface of the full-wafer contacter that faces away from the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.