Method and apparatus for stopping resin bleed and mold flash on integrated circuit lead finishes
US9054092B2 · kind B2 · utility
3Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2013 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | Oct 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus of minimizing resin bleed and mold flash on integrated lead finishes by providing groves on the external leads that can control the length of resin bleed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.