MEMS structures and methods for forming the same
US9054121B2 · kind B2 · utility
5Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2011 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | Aug 17, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0109
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method includes forming a MEMS device, forming a bond layer adjacent the MEMS device, and forming a protection layer over the bond layer. The steps of forming the bond layer and the protection layer include in-situ deposition of the bond layer and the protection layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.