Distorting donor wafer to corresponding distortion of host wafer
US9058974B2 · kind B2 · utility
3Cited by
13References
6Claims
0Family size
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Key dates
| Filing date | Jun 3, 2013 |
| Grant date | Jun 16, 2015 |
| Priority date | — |
| Expiry date | Aug 21, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/17
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Improving wafer-to-wafer bonding alignment. Determining planar distortions of the bonding surface of a host wafer. Mounting a donor wafer on a bonding chuck by a plurality of fixation points, the bonding chuck including multiple zones capable of movement relative to each other. Distorting the bonding surface of the donor wafer by moving the zones of the bonding chuck relative to each other to cause distortions of the bonding surface of the donor wafer such that the distortions of the donor wafer bonding surface correspond to the determined planar distortions of the host wafer bonding surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.