Patent · US Active

Packaging methods and packaged devices

US9059107B2 · kind B2 · utility

15Cited by

0References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Kuo Lung Pan · Hsinchu, TW
Ming Hung Tseng · Toufen, TW
Chen-Shien Chen · Hsinchu, TW

Key dates

Filing date	Sep 12, 2012
Grant date	Jun 16, 2015
Priority date	—
Expiry date	Sep 12, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Packaging methods and packaged devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes forming a first redistribution layer (RDL) over a carrier, and forming a plurality of through assembly vias (TAVs) over the first RDL. An integrated circuit die is coupled over the first RDL, and a molding compound is formed over the first RDL, the TAVs, and the integrated circuit die. A second RDL is formed over the molding compound, the TAVs, and the integrated circuit die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.