Semiconductor package with a bridge interposer

US9059179B2 · kind B2 · utility

Assignee

• Broadcom Corporation · US

Inventors

• Sampath K. V. Karikalan · Irvine, US
• Sam Ziqun Zhao · Irvine, US
• Kevin Kunzhong Hu · Irvine, US
• Rezaur Rahman Khan · Rancho Santa Margarita, US
• Pieter Vorenkamp · Aliso Viejo, US
• Xiangdong Chen · Irvine, US

Key dates

• Filing date: Dec 28, 2011
• Grant date: Jun 16, 2015
• Expiry date: Jan 8, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/30105
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

There are disclosed herein various implementations of semiconductor packages including a bridge interposer. One exemplary implementation includes a first active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The semiconductor package also includes a second active die having a first portion situated over the bridge interposer, and a second portion not situated over the bridge interposer. The second portion of the first active die and the second portion of the second active die include solder balls mounted on a package substrate, and are configured to communicate electrical signals to the package substrate utilizing the solder balls and without utilizing through-semiconductor vias (TSVs).