Controlled metal extrusion opening in semiconductor structure and method of forming

US9059258B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Max G. Levy · South Burlington, US
• Gary L. Milo · Colchester, US
• Matthew D. Moon · Jeffersonville, US
• Anthony C. Speranza · Georgetown, US
• Timothy D. Sullivan · Batavia, US
• David C. Thomas · Oklahoma City, US
• Steven S. Williams · Longmont, US

Key dates

• Filing date: Mar 4, 2013
• Grant date: Jun 16, 2015
• Expiry date: May 15, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Aspects of the present invention relate to a controlled metal extrusion opening in a semiconductor structure. Various embodiments include a semiconductor structure. The structure includes an aluminum layer. The aluminum layer includes an aluminum island within the aluminum layer, and a lateral extrusion receiving opening extending through the aluminum layer adjacent the aluminum island. The opening includes a lateral extrusion of the aluminum layer of the semiconductor structure. Additional embodiments include a method of forming a semiconductor structure. The method can include forming an aluminum layer over a titanium layer. The aluminum layer includes an aluminum island within the aluminum layer. The method can also include forming an opening extending through the aluminum layer adjacent the aluminum island within the aluminum layer. The opening includes a lateral extrusion of the aluminum layer of the semiconductor layer.