Light-emitting semiconductor packages and related methods

US9059379B2 · kind B2 · utility

Assignee

• ADVANCED SEMICONDUCTOR ENGINEERING, INC. · TW

Inventors

• Yen-Ting Kuo · Zhongpu, TW
• Ping Hu · Beijing, CN
• Yu-Fang Tsai

Key dates

• Filing date: Oct 29, 2012
• Grant date: Jun 16, 2015
• Expiry date: Oct 29, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857

Abstract

Light-emitting semiconductor packages and related methods. The light-emitting semiconductor package includes a central barrier, a plurality of leads, a light-emitting device, a first encapsulant, a package body, and a second encapsulant. The light-emitting device is disposed in the interior space defined by the central barrier and is electrically connected to the leads surrounding the central barrier. The light-emitting device includes upper and lower light-emitting surfaces. The first encapsulant and the second encapsulant cover the upper and lower light-emitting surfaces, respectively. The package body encapsulates portions of the central barrier, portions of each of the leads, and the first encapsulant. The light-emitting semiconductor package can emit light from both the upper and lower sides thereof.