Brazed joining with electrical deposition
US9061363B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2006 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Jul 15, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present method creates a relatively thin in situ brazing alloy layer upon first and second component edges which are brought together in order to create a component joint. This in situ brazing alloy layer is created by deposition of brazing elements, such as copper or nickel, from an electrical discharge cutting process electrode depletion utilized in order to cut the component edges, and then a subsequent brazing technique creates through interstitial migration between that brazing alloy layer and the underlying material substrate of the components a robust component joint wherein the in situ brazing alloy layer penetrates the respective component cut edge surface to only a limited depth such that the geometric effect is similarly limited, and the properties of the underlying component material structure are maintained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.