Hong Lee
2Patents
1h-index
5Co-inventors
27Inventor score
Filing activity: Dec 30, 2005 → Jul 3, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7524738B2 | Method for manufacturing semiconductor device | Electricity | 2 | Expired |
| US9061363B2 | Brazed joining with electrical deposition | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.