Packaging methods and structures using a die attach film
US9064879B2 · kind B2 · utility
754Cited by
69References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2011 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Dec 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Packaging methods and structures for semiconductor devices that utilize a novel die attach film are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer and forming a die attach film (DAF) that includes a polymer over the carrier wafer. A plurality of dies is attached to the DAF, and the plurality of dies is packaged. At least the carrier wafer is removed from the packaged dies, and the packaged dies are singulated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.