Bonding unit control unit and multi-layer bonding method
US9064910B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2010 |
| Grant date | Jun 23, 2015 |
| Priority date | — |
| Expiry date | Oct 27, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C99/0025
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.