Patent · US Active

Wire probe assembly and forming process for die testing

US9069014B2 · kind B2 · utility

1Cited by

1References

17Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Todd P. Albertson · Warren, US
Michael T. Crocker · Portland, US
David Shia · Portland, US
Lothar Kress · Boise, US

Key dates

Filing date	Jun 30, 2012
Grant date	Jun 30, 2015
Priority date	—
Expiry date	Jan 15, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49144
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A wire probe assembly and forming process is described. In one example, a method includes inserting a plurality of wires through a probe former and a tip retainer to contact a probe head substrate, attaching the wires to a surface of the substrate, pulling the probe former laterally with respect to the substrate surface and the tip retainer to bend the wires into test probes with a resiliency to transverse movement, and removing the tip retainer to form a test probe head.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.