Method of forming surface protrusions on an article and the article with the protrusions attached
US9070586B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2014 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Feb 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/381
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of forming surface protrusions on an article, and the article with the protrusions attached. The article may be an Integrated Circuit (IC) chip, a test probe for the IC chip or any suitable substrate or nanostructure. The surface protrusions are electroplated to a template or mold wafer, transferred to the article and easily separated from the template wafer. Thus, the attached protrusions may be, e.g., micro-bumps or micro pillars on an IC chip or substrate, test probes on a probe head, or one or more cantilevered membranes in a micro-machine or micro-sensor or other micro-electro-mechanical systems (MEMS) formed without undercutting the MEMS structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.