Workpiece breakage prevention method and apparatus
US9070590B2 · kind B2 · utility
3Cited by
255References
47Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2009 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | May 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for heat-treating a workpiece are disclosed. An illustrative method includes measuring deformation of a workpiece during heat-treating thereof, and taking an action in relation to the heat-treating of the workpiece, in response to the measuring of the deformation of the workpiece. The workpiece may include a semiconductor wafer. Taking an action may include applying a deformation correction to a temperature or reflectivity measurement of the wafer during thermal processing, or may include modifying the heat-treating of the wafer, for example.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.