Integrated circuit with sensor and method of manufacturing such an integrated circuit
US9070695B2 · kind B2 · utility
0Cited by
10References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2012 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Dec 19, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit package for an integrated circuit having one or more sensor elements in a sensor element area of the circuit. An encapsulation covers bond wires but leaves an opening over the sensor element area. A protection layer is provided over the integrated circuit over which the encapsulation extends, and it has a channel around the sensor element area to act as a trap for any encapsulation material which has crept into the opening area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.