Booster antenna for a chip arrangement, contactless smart card module arrangement and chip arrangement

US9070979B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Guenter Hofer · St. Oswald, AT
• Gerald Holweg · Graz, AT
• Walther Pachler · Graz, AT

Key dates

• Filing date: Oct 2, 2013
• Grant date: Jun 30, 2015
• Expiry date: Oct 2, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01Q7/00
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

In various embodiments, a booster antenna for a chip arrangement, for example a smart card, is provided. The booster antenna can have: a first electrical circuit, which forms a first resonant circuit with a phase resonance; and a second electrical circuit, which forms a second resonant circuit with a phase resonance and/or absolute resonance; wherein the first electrical circuit and the second electrical circuit are coupled to one another.