Process for fabricating a three dimensional molded feed structure
US9072164B2 · kind B2 · utility
0Cited by
21References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2009 |
| Grant date | Jun 30, 2015 |
| Priority date | — |
| Expiry date | Apr 25, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for fabricating a three dimensional molded feed structure is provided. In one embodiment, the invention relates to a process for fabricating a three dimensional radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a first preselected pattern of channels in the flexible circuit substrate, depositing a conductive layer on the formed flexible substrate, and removing portions of the conductive layer to form a plurality of conductive traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.