Patent · US Active

Method for slicing wafers from a workpiece

US9073135B2 · kind B2 · utility

0Cited by

8References

8Claims

0Family size

Assignee

Siltronic AG · DE

Inventors

Anton Huber · Burghausen, DE
Wolfgang Gmach · Emmerting, DE
Robert Kreuzeder · Wurmannsquick, DE
Peter Wiesner · Simbach, DE

Key dates

Filing date	Mar 19, 2012
Grant date	Jul 7, 2015
Priority date	—
Expiry date	Jun 8, 2033

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB28D5/045
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A method for slicing wafers from a workpiece includes providing wire guide rolls that each have a grooved coating with a specific thickness, providing a fixed bearing respectively associated with each wire guide roll and providing a sawing wire including wire sections disposed in a parallel fashion. The wire sections are tensioned between the wire guide rolls and are moved relative to the workpiece so as to perform a sawing operation. The wire guide rolls cooled and the fixed bearings are cooled independently of the wire guide rolls.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.