Substrate processing apparatus, substrate supporter and method of manufacturing semiconductor device
US9076644B2 · kind B2 · utility
0Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2012 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Mar 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus of the present invention includes a substrate placement stage installed in the process chamber, and configured to place the substrate on a substrate placement surface, with a flange provided on its side face; a heating element arranged in the substrate placement stage and configured to heat the substrate; a plurality of struts configured to support the flange from below, and an exhaust unit configured to exhaust an atmosphere in the process chamber, wherein the supporting member is provided between the substrate placement stage and the plurality of struts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.