Power module package
US9076660B2 · kind B2 · utility
3Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2013 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Dec 11, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a power module package including: a first module configured of a first substrate having one surface and the other surface, a first semiconductor chip mounted on one surface of the first substrate, and a first sealing member formed to cover the first semiconductor chip mounted on one surface of the first substrate from both sides in a thickness direction of the first substrate and expose the other surface of the first substrate; and a case enclosing the first module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.