Wafer supporting structure, intermediate structure of a semiconductor package including the wafer supporting structure
US9076701B2 · kind B2 · utility
2Cited by
4References
3Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 3, 2014 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Jan 3, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2839
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer supporting structure includes a supporting substrate for supporting a wafer, a release layer for detaching the wafer from the supporting substrate, and an adhesive layer for attaching the wafer to the supporting substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.