Patent · US Active

Semiconductor component comprising magnetic field sensor

US9076717B2 · kind B2 · utility

1Cited by

6References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Horst Theuss · Wenzenbach, DE
Albert Auburger · Regenstauf, DE

Key dates

Filing date	Dec 8, 2006
Grant date	Jul 7, 2015
Priority date	—
Expiry date	Apr 5, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH10N52/80
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The invention relates to a semiconductor component (100) comprising a semiconductor chip (10) configured as a wafer level package, a magnetic field sensor (11) being integrated into said semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.