Resin composition, prepreg, laminate, and wiring board
US9078365B2 · kind B2 · utility
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1References
11Claims
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Key dates
| Filing date | Apr 26, 2007 |
| Grant date | Jul 7, 2015 |
| Priority date | — |
| Expiry date | Mar 20, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/20
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, and a prepreg, a laminate, and a wiring board formed using the resin composition. The resin composition comprises an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as determined from an elastic shear modulus of the insulating resin measured at a temperature of Tg or higher.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.