Polishing pad
US9079289B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2012 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Aug 24, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2101/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The purpose of the present invention is to provide: a polishing pad which has improved dressing properties, while maintaining the hardness; or a polishing pad which does not easily make a scratch on the surface of an object to be polished, while having improved dressing properties. A polishing pad of the present invention is characterized by having a polishing layer that is formed of a polyurethane resin foam or an unfoamed polyurethane resin, and is also characterized in that the polyurethane resin foam or the unfoamed polyurethane resin contains, as starting material components, (A) an isocyanate component, (B) a polyol component and (C) an aromatic compound that has one hydroxyl group and/or an aromatic compound that has one amino group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.