Integrated microphone package
US9079760B2 · kind B2 · utility
2Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2013 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Jun 20, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/086
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus has a packaged microphone with a base and a lid that at least in part form an interior chamber containing a microphone die. The base has a bottom surface with an electrical interface and a base aperture. The apparatus also has a device housing having an internal surface, and a filter extending between the internal surface of the device housing, through an underlying substrate, and the bottom surface of the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.