Adhesive bonding technique for use with capacitive micro-sensors
US9082681B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2013 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Mar 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micro-sensor device that includes a passivation-protected ASIC module and a micro-sensor module bonded to a patterned cap provides protection for signal conditioning circuitry while allowing one or more sensing elements in the micro-sensor module to be exposed to an ambient environment. According to a method of fabricating the micro-sensor device, the patterned cap can be bonded to the micro-sensor module using a planarizing adhesive that is chemically compatible with the sensing elements. In one embodiment, the adhesive material is the same material used for the dielectric active elements, for example, a photo-sensitive polyimide film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.