Circuit module
US9082745B2 · kind B2 · utility
9Cited by
15References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2010 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Oct 9, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit module can include a substrate, photonic conversion units placed on the substrate; and a retention assembly. The retention assembly can include a heat sink in thermal contact with the photonic conversion units and a fastener. The fastener can be mechanically coupled to both the substrate and the heat sink, and configured to press the heat sink against the photonic conversion units. The plurality of photonic conversion units are removably secured to the substrate by the retention assembly without the use of a bonding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.