Joint structure for substrates and methods of forming
US9082763B2 · kind B2 · utility
36Cited by
10References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2012 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Sep 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed embodiments include wire joints and methods of forming wire joints that can enable realization of fine pitch joints and collapse control for various packages. A first embodiment is a structure comprising a first substrate, a second substrate, and a wire joint. The first substrate comprises a first bonding surface, and the second substrate comprises a second bonding surface. The first bonding surface is opposite and faces the second bonding surface. The wire joint is attached to and between the first bonding surface and the second bonding surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.