Triboelectric charge controlled electrostatic clamp
US9082804B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2011 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Sep 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic clamp which more effectively removes built up charge from a substrate prior to removal is disclosed. Currently, the lift pins and the ground pins are the only mechanism used to remove charge from the substrate after implantation. The present discloses describes an electrostatic chuck in which the top dielectric surface has an embedded conductive region, such as a ring shaped conductive region in the sealing ring. Thus, regardless of the orientation of the substrate during release, at least a portion of the substrate will contain the conductive region on the dielectric layer of the workpiece support. This conductive region may be connected to ground through the use of conductive vias in the dielectric layer. In some embodiments, these conductive vias are the fluid conduits used to supply gas to the back side of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.