Patent · US Active

Method and apparatus for mounting semiconductor chips

US9082816B2 · kind B2 · utility

0Cited by

5References

2Claims

0Family size

Assignee

ESEC AG · CH

Inventors

Marco Graf · Tamm, DE
Dominik Hartmann · Hagendorn, CH
Juergen Stuerner · Volders, AT

Key dates

Filing date	Jul 2, 2012
Grant date	Jul 14, 2015
Priority date	—
Expiry date	May 7, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/17
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor mounting apparatus has a dispensing station configured to dispense adhesive portions to the substrate locations of a substrate, a bonding station configured to place semiconductor chips on the substrate locations and a transport device configured to transport the substrates along a transport path. The transport device includes a buffer station disposed between the dispensing station and the bonding station. The buffer station is configured to temporarily remove a substrate which is to be transported from the dispensing station to the bonding station, or in reverse direction, from the transport path so that another substrate can be transported by the transport device from the bonding station to the dispensing station, or in reverse direction, respectively.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.