Semiconductor component and method of manufacture
US9082868B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2013 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Mar 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor component and a method for manufacturing the semiconductor component. In accordance with an embodiment, the semiconductor component includes a plurality of stacked semiconductor chips mounted to a support structure, wherein one semiconductor chip has a side with a plurality of electrical contacts electrically coupled to conductive tabs of the support structure. An electrical connector electrically connects an electrical contact formed from a side opposite the side with the plurality of electrical contacts to a corresponding conductive tab. Another semiconductor chip is mounted to the electrical connector and electrical contacts formed from this semiconductor chip are electrically connected to corresponding conductive tabs of the support structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.