Substrate of semiconductor package and method of fabricating semiconductor package using the same
US9082871B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Feb 11, 2015 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Feb 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.