Inventor · Seojong-myeon, KR

Teak-Hoon Lee

25Patents
5h-index
33Co-inventors
65Inventor score

Filing activity: Apr 16, 2008 → Jan 24, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US7807512B2 Semiconductor packages and methods of fabricating the same Electricity 92 Active
US8455301B2 Method of fabricating stacked chips in a semiconductor package Electricity 18 Active
US9721930B2 Semiconductor package and method for fabricating the same Electricity 8 Active
US8637969B2 Stacked chips in a semiconductor package Electricity 5 Active
US8637350B2 Method of manufacturing chip-stacked semiconductor package Electricity 5 Active
US8093703B2 Semiconductor package having buried post in encapsulant and method of manufacturing the same Electricity 4 Active
US8008771B2 Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device Emerging Cross-Sectional Technologies 3 Active
US9159651B2 Semiconductor packages having TSV and adhesive layer Electricity 2 Active
US9136260B2 Method of manufacturing chip-stacked semiconductor package Electricity 2 Active
US10867857B2 Method of cutting substrate and method of singulating semiconductor chips Electricity 1 Active
US11923343B2 Semiconductor package and method of fabricating the same Electricity 1 Active
US8344497B2 Semiconductor package and electronic device having the same Electricity 1 Active
US10930613B2 Semiconductor package having recessed adhesive layer between stacked chips Electricity 1 Active
US12074141B2 Semiconductor package Electricity 0 Active
US8987904B2 Substrate of semiconductor package and method of fabricating semiconductor package using the same Electricity 0 Active
US9082871B2 Substrate of semiconductor package and method of fabricating semiconductor package using the same Electricity 0 Active
US8846446B2 Semiconductor package having buried post in encapsulant and method of manufacturing the same Electricity 0 Active
US8154122B2 Semiconductor package and methods of manufacturing the semiconductor package Emerging Cross-Sectional Technologies 0 Active
US11538792B2 Semiconductor package and method of fabricating the same Electricity 0 Active
US11594499B2 Semiconductor package Electricity 0 Active
US12165991B2 Semiconductor package Electricity 0 Active
US11848293B2 Semiconductor package Electricity 0 Active
US12362328B2 Semiconductor package and method of fabricating the same Electricity 0 Active
US12400980B2 Semiconductor package Electricity 0 Active
US12113050B2 Semiconductor package with increased thermal radiation efficiency Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.