Multi-die LED package
US9082921B2 · kind B2 · utility
9Cited by
26References
64Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2012 |
| Grant date | Jul 14, 2015 |
| Priority date | — |
| Expiry date | Dec 18, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting device comprising (a) a submount having front and back sides and including a ceramic layer; (b) an array of light-emitting diodes (LEDs) on the front side; and (c) a lens overmolded on the submount and covering the LED array. In some embodiments, the submount comprises at least two electrically-conductive contact pads on the front side, and each LED in the array is secured with respect to one of the contact pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.