Patent · US Active

Multi-die LED package

US9082921B2 · kind B2 · utility

9Cited by
26References
64Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 6, 2012
Grant dateJul 14, 2015
Priority date
Expiry dateDec 18, 2032

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/8585
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A light-emitting device comprising (a) a submount having front and back sides and including a ceramic layer; (b) an array of light-emitting diodes (LEDs) on the front side; and (c) a lens overmolded on the submount and covering the LED array. In some embodiments, the submount comprises at least two electrically-conductive contact pads on the front side, and each LED in the array is secured with respect to one of the contact pads.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.